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UMC and AP Memory Collaborate to Enable Advanced Power Delivery Solutions for AI and HPC Systems
HSINCHU, Oct. 22, 2026 /PRNewswire/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC") and AP Memory (TWSE: 6531) today announced a technology and manufacturing collaboration to advance power delivery solutions for AI and high-performance computing (HPC) systems. This partnership combines UMC's deep trench capacitor (DTC) foundry technology and scalable wafer manufacturing with AP Memory's silicon capacitor designs and system-level integration to address the power efficiency challenges of next-generation data centers.
HSINCHU, Oct. 22, 2026 /PRNewswire/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC") and AP Memory (TWSE: 6531) today announced a technology and manufacturing collaboration to advance power delivery solutions for AI and high-performance computing (HPC) systems. This partnership combines UMC's deep trench capacitor (DTC) foundry technology and scalable wafer manufacturing with AP Memory's silicon capacitor designs and system-level integration to address the power efficiency challenges of next-generation data centers.
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